Tender to Supply Surface Grinders
We seek to acquire an automated wafer surface grinding system with ancillary equipment to enhance the University of Southampton’s optical and semiconductor materials processing capabilities.
United Kingdom-Southampton: Milling machines
Section I: Contracting authority
I.1)Name, addresses and contact point(s)
University of Southampton
Contact point(s): https://in-tendhost.co.uk/universityofsouthampton
For the attention of: John Davidson
SO17 1BJ Southampton
Telephone: +44 2380594088
General address of the contracting authority: https://in-tendhost.co.uk/universityofsouthampton/
Address of the buyer profile: https://in-tendhost.co.uk/universityofsouthampton/
Further information can be obtained from: The above mentioned contact point(s)
Specifications and additional documents (including documents for competitive dialogue and a dynamic purchasing system) can be obtained from: The above mentioned contact point(s)
Tenders or requests to participate must be sent to: The above mentioned contact point(s)
I.2)Type of the contracting authority
I.4)Contract award on behalf of other contracting authorities
Section II: Object of the contract
II.1.1)Title attributed to the contract by the contracting authority:
II.1.2)Type of contract and location of works, place of delivery or of performance
NUTS code UKJ32
II.1.3)Information about a public contract, a framework agreement or a dynamic purchasing system (DPS)
II.1.5)Short description of the contract or purchase(s)
We seek to acquire an automated wafer surface grinding system with ancillary equipment to enhance the University of Southampton’s optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of; Quantum Technologies and Photonics. This system will be integrated into existing lab facilities in the Optoelectronics Research Centre at the University of Southampton and will be used to expand the breadth of our manufacturing capabilities to stimulate new research ties across academia and industry via the EPSRC Quantum Hub initiative. The acquisition of this system will enable university researchers to manufacture new combinations of micron-scale-thickness optical and semiconductor material layers to tackle fundamental research in quantum light-matter interactions, quantum sensors, and telecommunications.
Purpose of the Equipment.
Planarisation and thinning of optical and semiconductor wafer materials to dimensions and surface roughness suitable for optical applications. The first example application will be thinning of carrier-bonded lithium niobate crystal wafers to layer thicknesses of 10 microns or less with a surface finish suitable for optical propagation (<3nm roughness Sa). Other applications include replanarisation of commercially available lithium niobate wafers to improve parallelism and surface finish. Other applications include grinding partial areas of wafers to create wafer-rim supported thin-film membranes.
Planarisation and thinning of a wide range of optical and semiconductor materials are envisaged, including but not limited to; lithium niobate, silicon, silica-on-silicon, silica, and sapphire as well as composites of the above. To ensure compatibility with existing University of Southampton facilities and a broad range of material types, the system is required to support standard wafer formats from 75 mm to 150 mm diameter as well as single die.
System to incorporate automated grinding capabilities in a single unit. The system must be capable of thinning wafer sizes up to 150 mm diameter with total thickness variation of ±2?m with average variation in thickness removal of less than 1?m wafer-to-wafer. The system must be able to achieve surface roughness less than 3nm (Sa) on lithium niobate. The system must offer the capability for grinding partial areas of wafers to create wafer-supported thin-film membranes as standard or via system upgrade. System to include either a universal mounting chuck for 75 mm, 100 mm, and 150 mm wafers or separate user swappable chucks for this purpose as well as mounting capability for thin substrates and single die. The system must be designed to allow unattended operation without operator intervention. A grinding system that does not require the use and disposal of chemical slurries is preferred.
Under no circumstances whatsoever will the University be liable for or pay any expenses or costs which may be incurred (whether directly or indirectly) by the tenderer in the preparation or submission of their tender proposal.
The University is not bound to accept the lowest offer or any tender in full or in part.
In evaluating the tender, the University will seek the most economically advantageous offers in terms of the criteria listed below:
High-level criteria. (Cost / Quality = 20:80)
Mandatory requirements — Pass/Fail.
Price 20 %
Technical Suitability 60 %
Service/ Maintenance / training and support 20 %.
II.1.6)Common procurement vocabulary (CPV)
II.1.7)Information about Government Procurement Agreement (GPA)
II.1.9)Information about variants
II.2.1)Total quantity or scope:
The estimated contract value for the initial four years of the contract, including purchase and implementation, is in the region of 260 000 GBP.
Estimated value excluding VAT:
Range: between 170 000 and 200 000 GBP
II.3)Duration of the contract or time limit for completion
Section III: Legal, economic, financial and technical information
III.1.1)Deposits and guarantees required:
III.1.2)Main financing conditions and payment arrangements and/or reference to the relevant provisions governing them:
III.1.3)Legal form to be taken by the group of economic operators to whom the contract is to be awarded:
III.2.2)Economic and financial ability
To support the financial assessment the University will obtain a financial appraisal report from Creditsafe. This report provides the University with an overall Risk Score which will be used to assess the applicants financial standing. A suitable Performance Bond or Parent Company Guarantee may at the University’s discretion be accepted and allowed to override a poor credit score.
Minimum level(s) of standards possibly required: Organisations are advised that the following minimum insurance levels are required:
Employers Liability 5 000 000 GBP.
Public Liability 5 000 000 GBP.
Professional Indemnity 5 000 000 GBP.
Section IV: Procedure
IV.1.1)Type of procedure
IV.2.2)Information about electronic auction
IV.3.1)File reference number attributed by the contracting authority:
IV.3.2)Previous publication(s) concerning the same contract
IV.3.3)Conditions for obtaining specifications and additional documents or descriptive document
Payable documents: no
IV.3.4)Time limit for receipt of tenders or requests to participate
IV.3.6)Language(s) in which tenders or requests to participate may be drawn up
IV.3.7)Minimum time frame during which the tenderer must maintain the tender
Section VI: Complementary information
VI.2)Information about European Union funds
This tender will be conducted electronically and tender documents can be downloaded from the web portal (Intend) provided earlier in this notice.https://in-tendhost.co.uk/universityofsouthampton.
If you are not already registered as a supplier with the In-tend Portal, you will need to register before accessing the tender documents.
Once you have logged in as a supplier, click on current tenders and locate the tender documents by clicking on 15/ESM/91. Further instructions for the submission of tender are below. (Please note, to preserve the integrity of the tendering procedure, all queries must made be via In-Tend).
To submit your return, please follow the instructions below:
1. Log In.
2. My Tenders.
3. View Tender Details.
4. View Documents.
5. Browse and Upload each part of your return (or Zip File).
6. Once ALL your response documents are uploaded and displayed in the — My Documents for Return — use — Submit My Return -. You are only permitted to submit once.
Expressions of Interest must be by way of completion and return of the Invitation to Tender document via the University’s e-tendering system In-Tend by the date and time specified in IV.3.4.
Due to the nature of this project, it has been deemed not appropriate to divide the requirement into lots.
Please note that the deadline for submitting clarifications is 12 noon on the 12.11.2015.
VI.5)Date of dispatch of this notice: